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 MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
9 Bit Buffer
The MC10E/100E122 is a 9-bit buffer. The device contains nine non-inverting buffer gates.
MC10E122 MC100E122
* 500ps Max. Propagation Delay * Extended 100E VEE Range of - 4.2V to - 5.46 V * 75k Input Pulldown Resistors
9-BIT BUFFER
Pinout: 28-Lead PLCC (Top View)
D8 25 D7 D6 D5 VEE D4 D3 D2 26 27 28 1 2 3 4 5 D1 6 D0 7 VCCO 8 Q0 9 Q1 10 VCCO 11 Q2 D0 D1 D2 NC 24 NC 23 VCCO NC 22 21 Q8 20 VCCO 19 18 17 16 15 14 13 12 Q7 Q6 VCC Q5 Q4 VCCO Q3 FN SUFFIX PLASTIC PACKAGE CASE 776-02
LOGIC DIAGRAM
Q0 Q1 Q2 Q3 Q4 Q5 Q6 Q7 Q8
* All VCC and VCCO pins are tied together on the die.
PIN NAMES
Pin D0 - D8 Q0 - Q8 Data Inputs Data Outputs Function
D3 D4 D5 D6 D7 D8
12/93
(c) Motorola, Inc. 1996
2-1
REV 2
MC10E122 MC100E122
DC CHARACTERISTICS (VEE = VEE(min) to VEE(max); VCC = VCCO = GND)
0C Symbol IIH IEE Characteristic Input HIGH Current Power Supply Current 10E 100E 41 41 min typ max 200 49 49 41 41 min 25C typ max 200 49 49 41 47 min 85C typ max 200 49 57 Unit A mA Condition
AC CHARACTERISTICS (VEE = VEE(min) to VEE(max); VCC = VCCO = GND)
0C Symbol tPLH tPHL tSKEW tr tf Characteristic Propagation Delay to Output D to Q Within-Device Skew D to Q Rise/Fall Times 20 - 80% 300 min 150 typ 350 75 425 800 300 max 500 min 150 25C typ 350 75 425 800 300 max 500 min 150 85C typ 350 75 ps 425 800 max 500 ps 1 Unit ps Condition
1. Within-device skew is defined as identical transitions on similar paths through a device.
MOTOROLA
2-2
ECLinPS and ECLinPS Lite DL140 -- Rev 4
MC10E122 MC100E122
OUTLINE DIMENSIONS
FN SUFFIX PLASTIC PLCC PACKAGE CASE 776-02 ISSUE D
0.007 (0.180) U T L -M
M
B -NY BRK
M
S
N
S S
0.007 (0.180)
T L -M
N
S
D Z -L-M-
W
28 1
D X VIEW D-D G1 0.010 (0.250)
S
V
T L -M
S
N
S
A Z R
0.007 (0.180) 0.007 (0.180)
M
T L -M T L -M
S
N N
S
H
S
0.007 (0.180)
M
T L -M
S
N
S
M
S
C
E G G1 0.010 (0.250)
S
K1 0.004 (0.100) J -TSEATING PLANE
K F VIEW S 0.007 (0.180)
M
VIEW S T L -M
S
T L -M
S
N
S
N
S
NOTES: 1. DATUMS -L-, -M-, AND -N- DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE. 2. DIM G1, TRUE POSITION TO BE MEASURED AT DATUM -T-, SEATING PLANE. 3. DIM R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE. 4. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 5. CONTROLLING DIMENSION: INCH. 6. THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY. 7. DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037 (0.940). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635).
DIM A B C E F G H J K R U V W X Y Z G1 K1
INCHES MIN MAX 0.485 0.495 0.485 0.495 0.165 0.180 0.090 0.110 0.013 0.019 0.050 BSC 0.026 0.032 0.020 -- 0.025 -- 0.450 0.456 0.450 0.456 0.042 0.048 0.042 0.048 0.042 0.056 -- 0.020 2 10 0.410 0.430 0.040 --
MILLIMETERS MIN MAX 12.32 12.57 12.32 12.57 4.20 4.57 2.29 2.79 0.33 0.48 1.27 BSC 0.66 0.81 0.51 -- 0.64 -- 11.43 11.58 11.43 11.58 1.07 1.21 1.07 1.21 1.07 1.42 -- 0.50 2 10 10.42 10.92 1.02 --
ECLinPS and ECLinPS Lite DL140 -- Rev 4
2-3
MOTOROLA
MC10E122 MC100E122
Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. "Typical" parameters which may be provided in Motorola data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. Motorola does not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part. Motorola and are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer. How to reach us: USA/EUROPE/Locations Not Listed: Motorola Literature Distribution; P.O. Box 20912; Phoenix, Arizona 85036. 1-800-441-2447 or 602-303-5454 MFAX: RMFAX0@email.sps.mot.com - TOUCHTONE 602-244-6609 INTERNET: http://Design-NET.com
JAPAN: Nippon Motorola Ltd.; Tatsumi-SPD-JLDC, 6F Seibu-Butsuryu-Center, 3-14-2 Tatsumi Koto-Ku, Tokyo 135, Japan. 03-81-3521-8315 ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park, 51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852-26629298
MOTOROLA 2-4
*MC10E122/D*
MC10E122/D ECLinPS and ECLinPS Lite DL140 -- Rev 4


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